Optical & Precision UV Adhesives
Low shrinkage, low stress and refractive-index control for optical communication, LiDAR and active alignment.
Electronic adhesive engineering · Suzhou, China
Adhesives engineered around the process.
MoleLinker develops high-performance electronic adhesives, application-specific formulations and cost-effective alternative solutions for demanding manufacturing processes.
01Applicationdefines the chemistry
UV CURE
EPOXY
THERMAL
CONDUCTIVE
MOLELINKER / 2026Scroll to discover ↓
Technology platforms
Focused materials for
difficult failure modes.
Our current portfolio concentrates on high-difficulty applications where material chemistry, process window and long-term reliability must work together.
UV / dual cure
Semiconductor Underfill
LG-E7163 and LG-E7167 support fast capillary flow, low CTE and high-Tg package reinforcement.
Conductive Silver Adhesives
LG-C3181 and LG-CA8068 balance conductivity, dispensability and heat dissipation for die attach.
Thermal Interface Materials
LG-HC0407 and LG-TC1476 provide low thermal resistance for processors and power devices.
COF Encapsulation
LG-E1327 and LG-U1077 are designed for fine-pitch lead protection with high purity and low ionic content.
PUR, Silicone & High-Reliability Epoxy
Flexible and durable systems for mobile devices, wearables, motors and outdoor equipment.
Built for real applications
Six application families.
One development method.
01
Mobile / FPC / Cover Glass
Drop resistance, narrow borders, waterproofing and high-humidity reliability.
02
Acoustics & Wearables
Bonding difficult PI and PA surfaces, low VOC, sweat resistance and heat resistance.
03
Optical Communication
Low shrinkage, low stress, grinding resistance and refractive-index matching.
04
Camera & LiDAR
Low CTE, low outgassing and optical-path stability under automotive reliability cycles.
05
Semiconductor Packaging
Underfill flow, high Tg, low CTE, conductive bonding and corner fixing.
06
Motors & Outdoor Equipment
High-temperature bonding, weather resistance, vibration resistance and deep curing.
Alternative development
A better-fit material starts with the right questions.
Share the material you use today, the application and the process window. Our team translates those constraints into a candidate formulation and an evaluation path.
Product selection and equivalency must always be verified under the customer’s actual substrates, equipment and reliability requirements.
- 01
Define
Current product, substrates, dispense method, cure conditions and target performance.
- 02
Develop
Select from an existing platform or tailor key properties to the application.
- 03
Evaluate
Review technical data, sample performance and process compatibility.
- 04
Validate
Customer-side trials confirm fitness before production introduction.
SUZHOU / CHINAAbout MoleLinker
From polymer structure to customer validation.
Founded in 2023, MoleLinker New Materials develops and manufactures high-end electronic specialty materials in Zhangjiagang, Suzhou. The team combines international product-development experience with formulation, process engineering and production introduction.
Our work begins with the customer’s failure mode. We adjust resin structure, additives and fillers, align curing with the production process, then support sample and reliability validation.
30Electronic adhesive formulations documented in the company portfolio
DesignPolymer structure, resin synthesis and complex formulation balancing
ProcessUV and dual cure, vacuum impregnation and low-temperature sintering
Scale-upCustomer testing, second-source qualification and production introduction
Start with your application
Looking for a material
that fits your process?
Tell us what you are bonding, how you process it and what needs to improve. We’ll help define the next evaluation step.
ADDRESSRoom 318, Building B, Technology Entrepreneurship Park,
Zhangjiagang Free Trade Zone, Suzhou, Jiangsu, China
Zhangjiagang Free Trade Zone, Suzhou, Jiangsu, China