Semiconductor die attach
Bonding bare die to lead frames or substrates where attachment and electrical conduction are required together.
Conductive bonding
Attach the die.
Build the electrical path.
MoleLinker conductive silver adhesives combine a resin bonding matrix with a controlled silver-particle network, supporting electrical connection, mechanical attachment and heat transfer in semiconductor and electronic assemblies.
Applications
Electrical connection and attachment in one layer.
Conductive adhesive selection depends on substrate metallization, component sensitivity, bond-line geometry, cure limits and the electrical, thermal and mechanical requirements of the assembly.
LED packaging
Back-electrode attachment for red/yellow GaAs and SiC devices, supporting consistent placement and conductive contact.
MEMS devices
Die attachment for pressure, inertial and other compact MEMS packages with process-specific cure needs.
Sensors
Assembly of pressure, temperature, humidity and related sensor dies onto package structures.
Heat-sensitive components
Alternative bonding routes where conventional high-temperature soldering may exceed the component’s thermal budget.
Conductive repair and interconnect
Application-specific conductive bonding for small-area contacts, electrodes and electronic subassemblies.
Product platforms
Two conductive bonding strategies.
LG-C3181 and LG-CA8068 address different rheology and cure requirements. Final selection is based on dispense method, component placement, bond-line control, cure conditions and reliability testing.
High-viscosity conductive die-attach adhesive
A silver-filled platform designed for stable deposition, die placement and controlled spread in semiconductor attachment processes.
- Primary role
- Conductive die attach
- Rheology direction
- High-viscosity placement control
- Process focus
- Stable dispense and uniform spread
- Assembly value
- Electrical path plus mechanical attachment
- Typical uses
- IC, power device, LED and sensor die attach
Performance depends on metallization, dispense pattern, placement pressure, bond-line thickness and cure profile.
Room-temperature-cure silver adhesive
A conductive silver adhesive platform for assemblies that benefit from reduced thermal exposure and flexible process integration.
- Primary role
- Conductive component bonding
- Cure direction
- Room-temperature cure
- Process focus
- Consistent spread and contact formation
- Assembly value
- Conductive bonding for heat-sensitive parts
- Typical uses
- Semiconductor, sensor and electronic assembly
Cure time, conductivity and final strength must be confirmed under the actual temperature, humidity, geometry and surface conditions.
Process fit
Control the bond line from dispense to cure.
A conductive joint is only as reliable as its material distribution, interfaces and cure. Process development should connect deposition behavior with final electrical and mechanical performance.
Define
Confirm substrates, metallization, component size, thermal budget and target joint function.
Dispense
Select dot or patterned deposition and establish volume, placement and storage controls.
Place & cure
Control placement pressure, bond-line thickness and the grade-specific cure window.
Validate
Verify electrical contact, adhesion, thermal behavior and reliability on representative parts.
Evaluation framework
Measure the complete conductive joint.
Qualification should evaluate material handling, cured performance and the interfaces created by the production process.
- Viscosity and dispense stability
- Bond-line thickness
- Slump and spread
- Volume resistivity
- Contact resistance
- Die shear strength
- Cure completeness
- Reflow resistance
- Thermal cycling
- Silver-migration risk
Research foundation
Silver-material expertise from particle to process.
Dr. Zhang and the founding R&D team
Dr. Zhang’s research and industrial experience includes silver nanowires, flexible transparent conductive coatings, conductive pastes and silver-filled electronic adhesives. The platform applies this foundation to silver-particle morphology and grading, resin interfaces, rheology, bond-line control and the balance between conductivity and mechanical attachment.
Experience describes the team’s prior development background. Performance of each MoleLinker grade is verified separately for the customer’s application.Request an evaluation
Share your die, surfaces and cure limits.
We can recommend a starting platform and evaluation route based on metallization, dispense method, component size, bond-line target, electrical requirements and thermal budget. TDS/SDS and confirmed specifications are available for qualified projects.
Discuss your application ↗