Ferrule and fiber fixation
Positioning, bonding and pull-strength retention for fibers in ferrules, V-grooves, pigtails and metal supports.
Optical modules and device assembly
Fix micron-level positions.
Maintain the optical path.
Material directions for optical modules, transceivers, fiber arrays and active optical devices—developed around low shrinkage, low stress, precision dispensing, grinding resistance and long-term reliability.
Application scope
Each station sets a different requirement for position and durability.
Optical-path bonding and non-optical structural fixation cannot be summarized by one property set. Position, mechanical load, post-processing and environmental reliability must be defined separately.
Active-device coupling
Precision fixation of fibers to lasers or detectors in TOSA, ROSA, BOSA and related devices.
Fiber arrays and FAUs
Positioning and encapsulation of multiple fibers, array bases and housings with downstream end-face processing in mind.
Optical-element assembly
Low-stress bonding and positional retention for lenses, filters and other optical-path components.
Module structural assembly
Permanent bonding and reinforcement for PCBs, frames, covers, brackets and internal structures.
Pigtail strain relief and sealing
Protection at fiber entries, leads and connections to relieve bending and tensile stress while supporting moisture sealing.
Separate optical and structural stations
Optical-path locations emphasize shrinkage, stress, outgassing and micron-level movement. Structural fixation and strain relief emphasize strength, flexibility, vibration, impact and durable sealing.
Key challenges
Reliability begins with a stable optical path.
Material screening should combine post-cure movement, optical cleanliness, downstream processing and long-term environmental aging.
Low shrinkage and position retention
Control cure-volume change and movement after fixture release to reduce coupling-efficiency drift.
Low stress and thermal matching
Manage CTE differences and thermal-cycle stress across glass, metals, ceramics and engineering plastics.
Low outgassing and cleanliness
Reduce contamination of end faces, lenses, filters and detectors from volatiles, migration or cure by-products.
Grinding and post-processing
Evaluate cured hardness, wear resistance, edge chipping and interface integrity for arrays and ferrule end faces.
Difficult substrates and micro-gaps
Verify wetting, capillary flow and initial fixation on PEI-class plastics, metals, glass and ceramics.
Long-term environmental reliability
Validate humidity, thermal cycling, drop, vibration and pull retention against the intended service life.
Material directions
Select from optical sensitivity, cure access and post-processing.
Product grades will be added after the corresponding TDS values, appearance and validated application boundaries are confirmed.
UV or dual-cure precision positioning
For active alignment and rapid fixture; light access, shadow-area completion, shrinkage and stability after fixture release must be verified.
High-reliability epoxy bonding
For strong fixation of fibers, ferrules, optical elements and module structures, with thermal stress and lifetime validated by station.
Grinding-resistant array fixation
For V-grooves, FAUs and end-face processing, balancing flow, cured hardness, wear resistance and humidity durability.
Flexible strain relief and sealing
For pigtail entries, leads and non-optical structures, reducing stress from bending, impact and CTE mismatch.
Current project foundation
Direct-customer programs and validation by multiple optical-module companies.
This summary presents only the stations and validation status suitable for public use, without customer names, competitor information or unconfirmed specifications.
Non-optical structural bonding and pigtail strain relief
MoleLinker materials support optical modules for a leading integrated-optics customer, including upper and lower housing reinforcement, metal or plastic bracket fixation, anti-loosening dots, pigtail pull retention and strain relief, plus local protection near leads, connector pins and wire bonds. The focus is vibration, impact and long-term retention.
Polishing-compatible UV epoxy for fiber arrays
Designed for fixing fibers in V-grooves and fiber arrays, with rapid UV fixture and cured properties suited to mechanical polishing. The platform also considers automated dispensing, humidity durability and end-face processing, and has passed testing at multiple leading domestic optical-module and photonic-device companies.
Evaluation route
Measure bond strength and optical change together.
A single material property cannot represent performance inside an optical module. Final selection requires the device, dispense and alignment process.
Define the station
Separate optical-path and structural locations, then map substrates, gaps, adhesive volume, keep-out zones and post-processing.
Build the cure window
Set dispensing, open time, light or thermal cure, fixture-release time and production takt.
Monitor position and optics
Record movement, coupling efficiency, insertion loss, cleanliness and appearance before and after cure.
Complete reliability
Recheck strength, position, optical performance and seal integrity after environmental and mechanical loading.
TDS information to add
Key fields for future product matching.
No grade is bound to this application page until its published or internally confirmed data supports the intended use.
- Chemistry and cure mechanism
- Appearance, color and optical transmission
- Refractive index and optical-window suitability
- Viscosity, thixotropy and minimum gap
- Open time, fixture time and full cure
- Cure shrinkage and positional drift
- Tg, CTE and elastic modulus
- Shear, tensile and peel strength
- Applicable substrates and surface treatment
- VOC, outgassing, ionic and moisture data
- Grinding performance and end-face integrity
- Humidity, thermal cycling, drop and vibration results
Development background
From fiber fixation to active-module production introduction.
Dr. Zhang and the founding R&D team
The team’s prior work for leading domestic optical-module and photonic-device companies covered active-module structural adhesives, fiber fixation, optical-element positioning, FAUs and pigtail strain-relief materials. Project validation included difficult PEI-class substrates, 2,000-hour high-temperature/high-humidity aging, repeated drop and ±3 μm-class position control.
Experience describes the team’s prior development background. Performance of each MoleLinker grade is verified separately for the customer’s application.Start with the station
Share the device, alignment method and reliability target.
We can define a material direction and evaluation plan before matching a specific grade.
Discuss your application ↗