Capillary underfill
Uniform flow beneath the die to protect solder joints and interconnects.
Semiconductor Packaging
Protect interconnects.
Release package stress.
For automotive chips, consumer devices and power modules, material selection is built around capillary flow, low CTE, high Tg, conductive attach, edge reinforcement and thermal management.
Application scope
Every interface from die to underfill contributes to package life.
Materials must fit narrow gaps and production takt time while controlling thermal stress, ionic contamination and moisture aging.
Corner and edge bonding
Localized reinforcement for drop, bend and mechanical reliability.
Die attach and conductive bonding
Electrical and thermal connection for die-attach workstations.
COF and fine-pitch protection
Protection of fine-pitch leads, joints and flexible package areas.
Power devices and thermal interfaces
Stable thermally conductive, insulating or conductive interfaces.
Sensor and module encapsulation
Fixation, sealing and environmental protection for MEMS and sensors.
Key challenges
Precision workstations require material, structure and process to be validated together.
A single material property cannot predict long-term module performance.
Fast capillary flow
Complete fill within the target gap with minimal voiding.
Low CTE and high Tg
Reduce stress across die, joints and substrate during thermal cycling.
Low ions and high purity
Control corrosion, leakage and electrochemical migration.
Adhesion and warpage
Maintain interfaces across silicon, solder mask, substrate and metals.
Dispense and cure window
Balance pot life, flow, preheat and final cure takt time.
Automotive reliability
Retain package integrity after thermal, humidity, drop and vibration loads.
Material directions
Select chemistry from failure modes and process window.
Specific grades will be added after TDS, appearance and application boundaries are verified.
Capillary underfill epoxy
Fast flow, low voiding, low CTE and high Tg.
Corner and edge reinforcement
Localized mechanical reliability without full-area fill.
Conductive silver die attach
Dispensability, electrical and thermal conduction, and interface stability.
High-purity encapsulation
Low-ionic protection for COF, fine-pitch leads and sensitive electronics.
Current project foundation
A direct program has entered an automotive-chip underfill workstation.
The public page describes only anonymized application status; product grades and parameters will follow verified TDS data.
Automotive-chip underfill
MoleLinker underfill material is used at an automotive-chip packaging station for a leading domestic new-energy vehicle company, with focus on flow, thermal stress and long-term reliability.
Packaging material platform
The R&D platform spans underfill, conductive attach, COF protection and thermal interfaces for further matching to die, substrate and process window.
Evaluation path
Validate with real parts and production conditions.
Coupons support screening; final decisions come from the target structure and reliability profile.
Define workstation
Confirm substrates, gap, volume, keep-out zones, functional boundaries and target life.
Match the process
Define dispense, open time, cure, fixtures and production takt.
Screen real parts
Check flow, cure, adhesion, cleanliness, appearance and functional impact.
Validate reliability
Retest strength, position, function and interface integrity after aging.
TDS information to add
Key fields required for product matching.
No product grade is assigned until verified public or internal data supports the target use.
- Chemistry and cure mechanism
- Appearance, color and filler type
- Viscosity, thixotropy and flow distance
- Gap and die-size range
- Working life, preheat and cure conditions
- Tg, CTE and modulus
- Ionic content, water absorption and purity
- Shear, pull and drop reliability
- Void rate and fill completeness
- Thermal conductivity, volume resistivity and insulation
- Substrate, solder mask and surface treatment
- Thermal cycling, humidity, reflow, vibration and automotive results
R&D foundation
Connect material design with production validation.
Dr. Zhang and the founding R&D team
The team has developed semiconductor underfill, conductive silver adhesives, low-temperature sintered silver, COF protection and thermal-interface materials, from resin and filler design through dispense, cure and reliability validation.
This describes prior team experience. Each MoleLinker grade must be validated in the customer application.Start with the workstation
Tell us the device, substrates and reliability targets.
Before assigning a grade, we can define the material direction and evaluation plan.
Discuss your application ↗