Mobile-device frames
Narrow-border bonding of metal or plastic frames to display and touch structures.
Flexible assembly & sealing
Fast handling.
Durable final bond.
MoleLinker PUR, silicone and low-temperature epoxy platforms support narrow-border bonding, wearable-device sealing and precision-electronics assembly across difficult substrates and thermal limits.
Applications
Match chemistry to the assembly constraint.
Substrate combination, open time, initial handling, temperature limit, flexibility and environmental sealing determine the right platform.
Wearables
Window-to-housing sealing for watches, TWS earphones and compact devices.
Camera modules
Low-temperature precision bonding around heat-sensitive components.
FPC reinforcement
Localized reinforcement where flexibility, adhesion and process compatibility must balance.
Automotive electronics
Bonding and sealing designed around temperature, moisture and vibration exposure.
Outdoor equipment
Flexible, durable assembly materials for weather and mechanical stress.
Product platforms
Reactive hot melt and low-temperature epoxy.
These disclosed platforms provide different handling and final-cure paths. Silicone grades are selected separately against flexibility and sealing requirements.
High-flexibility reactive PUR hot melt
A one-component, 100% solids, solvent-free adhesive combining thermoplastic cooling for initial handling with moisture crosslinking for the final bond.
- Composition
- One-component, 100% solids
- Solvent
- Solvent-free
- Cure mechanism
- Cooling + moisture crosslinking
- Typical uses
- Frames, touch borders, TWS and watch sealing
Low-temperature epoxy adhesive
A modified epoxy platform for high-strength bonding of heat-sensitive precision electronics.
- Cure direction
- 60–90°C disclosed range
- Low-end response
- Some systems react from approximately 55°C
- Primary value
- Reduced thermal exposure
- Typical uses
- Camera modules, fingerprint IC, SMT, FPC and MEMS
Process fit
Balance handling speed and final durability.
Production trials should confirm dispense, open time, placement, initial fixture and full-cure reliability.
Define
Identify substrates, joint geometry, thermal limit and sealing target.
Apply
Set melt or dispense temperature, path, volume and open time.
Assemble
Control placement, pressure, cooling or low-temperature cure.
Validate
Test peel, strength, leak tightness and environmental durability.
Data to confirm
Parameters needed by product family.
- Viscosity or melt viscosity
- Application temperature
- Open and set time
- Full-cure schedule
- Hardness
- Lap-shear and peel strength
- Elongation
- Water-vapor resistance
- Operating temperature
- Storage and shelf life
Research foundation
Assembly-material experience across difficult substrates.
Dr. Zhang and the founding R&D team
The team’s prior programs for global leading consumer-electronics brands and domestic leading smart-device brands covered PUR, modified silicone, MMA and low-temperature epoxy systems. This experience supports narrow-border bonding, drop durability, flexibility, water sealing, heat-sensitive components and production-takt requirements across difficult substrate combinations.
Experience describes the team’s prior development background. Performance of each MoleLinker grade is verified separately for the customer’s application.Request an evaluation
Share your substrates, takt and sealing target.
We can match PUR, silicone or low-temperature epoxy chemistry to your assembly process.
Discuss your application ↗