Camera modules
Lens barrel and VCM motor fixation, focus-locking and precision positioning for mobile and automotive cameras.
Optical & precision bonding
Fast alignment.
Reliable final cure.
MoleLinker optical UV adhesives combine rapid light-triggered positioning with application-specific cure mechanisms for camera modules, displays, optical components and precision electronic assemblies.
Applications
Designed around the assembly process.
The right UV adhesive depends on light access, substrate combination, bond-line geometry and reliability requirements. We use these constraints to select or adapt the curing platform.
Display bonding
LOCA bonding for LCD/OLED panels and touch screens, with options for bubble control and flexible displays.
Optical connectivity
FC, LC and MT ferrule bonding, fiber-array assembly and other precision optical connections.
Micro-acoustics
Bonding of miniature loudspeaker voice coils and diaphragms in earphones and compact audio devices.
Wearable devices
Glass-to-metal frames and ceramic back covers for smart watches and compact consumer electronics.
Shadowed assemblies
Moisture-assisted post-cure for FPC joints, component edges and geometries that UV light cannot fully reach.
Product platforms
Two cure strategies.
Values below describe the disclosed development platforms and should be treated as typical process guidance. Final specifications are confirmed for the selected grade and customer application.
Single-component UV adhesive
Modified acrylate/epoxy system for rapid UV positioning and complete light cure in precision optical and electronic assemblies.
- Light response
- 320–420 nm UV or visible light
- Initial positioning
- 3–5 seconds
- Complete cure
- 10–30 seconds
- Positioning precision
- ±3 μm in the disclosed focusing process
- Typical uses
- Camera/VCM, LOCA display, fiber connectors, micro-acoustics, wearables
Performance depends on lamp spectrum, irradiance, exposure, bond-line thickness, substrates and fixture design.
UV + moisture dual-cure adhesive
Single-component dual-crosslinking system for rapid UV fixation followed by moisture cure in shadowed regions.
- Primary cure
- Fast UV positioning
- Secondary cure
- Ambient-moisture post-cure
- Key benefit
- Improved cure completeness in shadow areas
- Process profile
- Low operating temperature for heat-sensitive materials
- Typical uses
- Large LOCA assemblies, camera structures, FPC protection, dissimilar-material bonding
Moisture-cure speed depends on ambient humidity, temperature, geometry and adhesive thickness.
Process fit
From requirement to validated bond.
We recommend confirming both rapid positioning performance and long-term reliability on actual substrates and production equipment.
Define
Substrates, gap, dispense method, available light path and required takt time.
Select
Match UV-only or dual-cure chemistry to shadowing and temperature limits.
Evaluate
Establish exposure, fixture release, final cure and handling windows.
Validate
Test strength, optical quality and reliability using production-representative parts.
Evaluation framework
Test what matters to the application.
Test plans are adapted to the assembly rather than relying on a single headline property.
- Cure depth and conversion
- Bond strength after cure
- Position shift and shrinkage
- Optical clarity and yellowing
- Bubble and mura inspection
- Thermal cycling
- Damp-heat aging
- Substrate compatibility
- Shadow-area cure
- Dispense stability
Request an evaluation
Share your substrates, light source and reliability target.
We can recommend a starting platform, sample plan and practical evaluation route. TDS/SDS and confirmed specifications are available for qualified projects.
Discuss your application ↗