Flip-chip packages
Capillary filling beneath bumped die to reinforce solder joints and support package reliability.
Semiconductor package protection
Flow beneath.
Reinforce within.
MoleLinker capillary underfill materials flow into the narrow gap between die and substrate, helping distribute thermo-mechanical stress and reinforce solder interconnects through demanding reliability cycles.
Why underfill
Protect the interconnect from cyclic stress.
Silicon, solder and organic substrates expand at different rates. A properly selected underfill redistributes stress away from solder joints while preserving the process window required for complete, repeatable filling.
BGA & CSP assemblies
Package-level reinforcement where thermal cycling, drop or mechanical loading challenges interconnects.
Fine-gap structures
Low-viscosity flow designed around narrow stand-off height and dense interconnect geometries.
Mobile electronics
Compact packages requiring balanced flow, cure and mechanical protection in high-volume assembly.
Automotive electronics
Underfill selection guided by extended temperature cycling and long-term reliability targets.
High-density modules
Process-compatible reinforcement for tightly integrated computing, sensing and communications modules.
Product platforms
Two underfill starting points.
LG-E7163 and LG-E7167 are selected against package geometry, flow distance, preheat conditions, cure profile and reliability requirements. Final specifications are confirmed for the chosen grade and application.
Fast-flow capillary underfill
A semiconductor underfill platform focused on rapid capillary penetration and consistent filling beneath fine-gap packages.
- Flow mechanism
- Capillary action
- Process focus
- Fast, repeatable gap filling
- Package function
- Solder-joint reinforcement
- Material direction
- Low CTE, high Tg
- Selection inputs
- Gap, die size, flow distance and preheat
Flow behavior depends on dispense pattern, substrate temperature, stand-off height, surface condition and package geometry.
High-reliability underfill
A package-protection platform balancing capillary processability with thermomechanical reinforcement for demanding reliability targets.
- Flow mechanism
- Capillary action
- Reliability focus
- Thermal-cycle stress management
- Package function
- Interconnect protection
- Material direction
- Low CTE, high Tg
- Selection inputs
- Package design, cure profile and qualification plan
Final grade selection requires evaluation on actual components, board finish, dispense equipment and production cure conditions.
Process fit
Build a stable capillary-fill window.
Successful underfill depends on the material and the line working together. Evaluation should confirm filling completeness, cure and reliability on production-representative packages.
Define
Package dimensions, stand-off height, bump pitch, board finish and reliability target.
Dispense
Set preheat, needle position, shot size and dispense pattern for uniform capillary flow.
Cure
Match ramp, temperature and dwell to the assembly’s thermal budget and production takt.
Validate
Inspect fill quality and verify performance through application-specific reliability testing.
Evaluation framework
Control flow, voids and reliability.
Qualification should connect measurable material behavior to package geometry and the real production process.
- Viscosity and thixotropy
- Capillary flow time
- Void and fillet inspection
- Glass-transition behavior
- Coefficient of thermal expansion
- Cure profile
- Adhesion to die and substrate
- Thermal cycling
- Moisture sensitivity
- Drop and mechanical shock
Research foundation
From polymer interfaces to package reliability.
Dr. Zhang and the founding R&D team
The team combines semiconductor-packaging development with research in nanocomposite resins, inorganic fillers and polymer interfaces. This background supports underfill design that balances capillary flow, cure behavior, thermal-expansion matching and interconnect protection, followed by process validation on the actual package and equipment.
Experience describes the team’s prior development background. Performance of each MoleLinker grade is verified separately for the customer’s application.Request an evaluation
Share your package geometry and process window.
We can recommend a starting platform and evaluation route based on die size, gap, flow distance, preheat, cure conditions and reliability targets. TDS/SDS and confirmed specifications are available for qualified projects.
Discuss your package ↗