Processors & controllers
Interface filling between heat-generating devices, spreaders and heat sinks.
Thermal management
Move heat.
Protect the assembly.
MoleLinker thermal materials combine heat-conductive fillers with silicone or resin matrices to bridge interfaces, reduce thermal resistance and protect electronics from mechanical and environmental stress.
Applications
Connect the heat source to its cooling path.
Material selection is driven by heat flux, bond-line or gap, assembly pressure, electrical insulation, rework needs and the reliability environment.
Power electronics
Thermal management and protection for power modules, converters and high-load components.
Battery systems
Gap filling, module potting and thermal pathways in new-energy assemblies.
Sensors & modules
Low-stress encapsulation where heat dissipation and environmental protection are both required.
LED assemblies
Heat transfer away from compact light sources and their package structures.
Outdoor electronics
Thermal and environmental protection under temperature, moisture and vibration exposure.
Product platforms
Interface control and conductive potting.
Final values for thermal conductivity, viscosity, hardness and cure must be confirmed by grade and application.
Thermal interface platform
A low-thermal-resistance material direction for processors and power devices, selected around interface geometry and assembly pressure.
- Primary role
- Thermal interface filling
- Process focus
- Gap and bond-line control
- Selection inputs
- Heat flux, gap, pressure and insulation
- Data status
- Detailed values pending TDS confirmation
Thermally conductive silicone potting
A silicone-based conductive potting platform for low-stress heat transfer and protective encapsulation.
- Matrix direction
- Silicone
- Primary role
- Thermal potting and protection
- Filler direction
- Thermally conductive ceramic filler system
- Typical uses
- Electronics, modules and power assemblies
Process fit
Validate the complete thermal stack.
Evaluate material, interfaces and geometry together rather than relying on thermal conductivity alone.
Map heat
Define heat source, allowable temperature and cooling path.
Set geometry
Confirm gap, bond line, compression and dispense volume.
Process
Establish mixing, degassing, dispense and cure conditions.
Validate
Measure thermal response, insulation and reliability in the real assembly.
Data to confirm
Key parameters for grade selection.
- Thermal conductivity
- Thermal resistance
- Viscosity and thixotropy
- Density
- Hardness
- Dielectric strength
- Volume resistivity
- Cure schedule
- Operating temperature
- Flame rating
Research foundation
Composite-material insight for complete thermal systems.
Dr. Zhang and the founding R&D team
The team has research and development experience in inorganic-filler modified resins, nanoparticle interface control, alumina-reinforced epoxy and silicone composite systems. This foundation supports thermal-material design that considers not only conductivity, but also viscosity, gap filling, interface resistance, electrical insulation, cure stress and thermal cycling.
Experience describes the team’s prior development background. Performance of each MoleLinker grade is verified separately for the customer’s application.Request an evaluation
Share your heat source, gap and reliability target.
We can recommend a starting material and test route for the complete thermal stack.
Discuss your application ↗